Higashihiroshima Micron

Job Title:

JR52267 Engineer, DRAM Process Integration Pathfinding

About the Role:

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence. As a DRAM Process Integration Pathfinding Engineer within the Technology Development group at Micron, your primary responsibility will be to lead the efforts in developing a module for the next generation DRAM technology node.

Key Responsibilities:

  • Derive construction specifications based on electrical, inline metrics, unit processes, and design rules.
  • Design, complete, and analyze experiments necessary to meet engineering specifications based on structure to electrical correlations.
  • Solve problems with a model-based approach and drive technical innovation through process improvements, patents, and/or technical papers.
  • Develop, maintain, and improve one or more process modules including design rules and structural and electrical specifications for alternative flows.
  • Optimize existing process flows and develop creative solutions to meet product requirements.
  • Design and complete experiments and analyze results with statistical analysis software like JMP.
  • Feedback results to product to improve yield.
  • Extract, monitor, analyze, and react to inline, defect, param, and probe data to fix yield issues, increase performance and reliability, add process margin, and reduce costs.
  • Work across functions with Design, Product Engineering, Modeling, Yield Enhancement, Electrical, and Physical Failure analysis teams, Defect Analysis, Param, and Quality teams to understand issues, targets, and priorities for development.
  • Summarize complex problems, derive, explain actions taken to address them, and drive team to complete.
  • Define sub-milestones for the project within your module.
  • Maintain and enforce the best possible communication between Process Integration, Process Development, and the Pilot Fab.
  • Ensure timely documentation of R&D activities in your module for transfer to Manufacturing.

Requirements:

  • Bachelor's or PhD (Electrical Engineering, Microelectronics, Physics, or Material Science) or equivalent experience 5 years in industry.
  • Knowledge of semiconductor device physics and electrical characterization.
  • Knowledge of material science and semiconductor process fundamentals.
  • Proficient in data analysis through JMP, Python, or other data engineering software.
  • Interpersonal, oral, and written English communications-skills.

Preferred Experience:

  • 5 years' industry experience in process integration or a role that interacts with process integration and has a strong understanding of process integration requirements.
  • 2 years' experience DRAM manufacturing fab and/or DRAM transfer team experience.
  • Experience in front of line, middle of line, interconnect of DRAM modules.
  • Device Physics, Electronics, or Electrical Engineering background highly preferred.
  • Speak fluent Japanese.

Salary:

$120,000 - $180,000 per year.



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