Higashihiroshima Micron
Transforming Information for a Better World

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

We are seeking an experienced Device Engineer to join our Front End Manufacturing Central Team. As a key member of this team, you will work closely with the global Micron network to improve device performance, meet product yield and quality requirements, and optimize process steps, reducing device variability and improving engineering business processes.

The primary focus of this role is on DRAM, but may expand to NAND when necessary. To succeed in this position, you should have a strong background in semiconductor physics, including transistor operations, scaling limitations, and reliability. A deep understanding of at least one fabrication process area, including process mechanisms, tuning knobs, and tool sets, is also essential.

In addition to technical expertise, we value strong communication skills, fluent in English (speaking and written), and working-level communication capability in Mandarin Chinese or Japanese is preferred. Good computer skills with MS Office and programming experience in Python are a plus.

Key Responsibilities:
  • Work closely with the global Micron network to improve device performance.
  • Optimize process steps to reduce device variability and improve engineering business processes.
  • Develop and implement design layout and test specs to improve device performance.
  • Collaborate with other teams to achieve success.

Requirements:
  • Bachelor's degree in relevant field with 3+ years of experience in fab process or process integration or test engineering.
  • Master's degree in Physics or Engineering areas is preferred.
  • Direct experience in CMOS or memory device engineering is strongly preferred.

Estimated Salary: $120,000 - $180,000 per year

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