Engineer/Senior Engineer, Process Integration

3日前

Higashihiroshima Micron

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

JR57930 Engineer/Senior Engineer, Process Integration

As Technology Development (TD) DRAM Integration Technology department at Micron in Japan, we drive next generation of DRAM memory technology development through multi-functional responsibilities of module engineering, materials development and device engineering in Hiroshima plant TD

As the Engineer of Process Integration, you will work well with all assigned module related development activities in Fab15 TD but also work with related MFG Process Integration modules, developing process flows and process integration schemes with novel devices and new materials for next generation of DRAM, as well as finding innovative and manufacturable solutions to enable a successful transitioning of the new DRAM product which is developed in Fab15 TD to the manufacturing sites. You will ensure maximum partnership and cross–learning between the different sites and organizations. You will also be a member of the Micron Process R&D Project team across the sites (Hiroshima, Taiwan and Boise).

Responsibilities include but are not limited to the following:

  • Project responsibilities
  • Assume responsibility for all assigned module related transfer topics in F15 R&D (including process flow, tool selection, recipe optimization, characterization and data interpretation methods)
  • Facilitate x-learning and BKM sharing for all related module related topics between global sites/HVM fabrications
  • Assure that the right critical metric for inline, param, probe, burn and REL measurements are in place, assure appropriate reaction time for deviation and toggles
  • Work with Yield Enhancement, Process Engineering, Real-Time Defect Analysis, Physical Failure Analysis, Param, and Quality Assurance teams to understand issues and priorities
  • Pro-actively address technical issues by proposing solutions and bring up resource conflicting.
  • Take an ownership for across module activities and items in the critical path if required.
  • Define sub-milestones for the project and work with the team to achieve the targets and timelines
  • Work with Central Teams, Process areas, and planning teams to define MOR related activities.
  • Individual responsibilities
  • Provide technical leadership for all of the related module activities for the lifetime of the project.
  • Summarize a comprehensive problem, derive and explain actions taken to address them.
  • Drive effective multi-functional communication on issue for resolution.

    • Qualifications

  • > 3 years of Process Integration or Process Development experience.
  • Experience for the introduction and yield ramp for at least one DRAM generation.
  • Capability to resolve an issue that span multiple groups.
  • Ability to think and communicate clearly in urgent and stressed situations.
  • Strong understanding of DRAM process flow as well as common Pareto issues.
  • Understanding interaction of process and device.
  • Previous exposure to transfer or production for at least one memory generation.
  • Proficient communication skill in Japanese is a requirement.
  • Well understanding of English will be a significant plus.
  • Understanding of Chinese would be a plus.

    • Education

    Master of Science Degree in Electrical Engineering, Microelectronics, or related subject area is required (unless relevant multi-year working expertise rationalizes waiving this requirement)

    Relocation:

    Relocation might be provided on a case by case basis.

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