CMP/Bond Process Engineer

2日前

Higashihiroshima Micron

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

JR57983 CMP/Bond Process Engineer

As a CMP/Bond Process Engineer in our Process Development organization based in Hiroshima, Japan, you will be expected to develop CMP or Bond related process with the latest deployment of technology nodes, the process margin improvement work necessitated thereof as well as to ensure extended engagement with manufacturing on the upcoming technology nodes. Expected to work independently with minimal direction and complete projects in a timely manner and achieve set objectives.

Responsibilities:

  • Support CMP or Bond Process developments/improvements as well as technology transfer on DRAM in R&D at initial stages and carry on subsequently in the manufacturing environment.
  • Identify and evaluate interactions between equipment, modules and processes and resolve related issues.
  • Resolve yield and reliability issues through process development.
  • Stay engaged with vendors on strategic process/hardware evaluations.
  • Work closely with manufacturing Fab and understand manufacturing issues.
  • Work closely with PI groups to understand implications of inline/probe/parametric data and find opportunities for process improvement.
  • Design multi-level SWRs using DOE concept and develop framework for process changes and conversion.
  • Initiate and manage experiments to widen process margins as well as to test out manufacturability of next node solutions – effective interaction with manufacturing on such areas.
  • Incorporate best known manufacturing methods into early development phase of upcoming nodes.
  • Provide technical documentation for new technology transfer.
  • Interact positively with the group, pilot line, vendors, integration, manufacturing, management, to contribute to key improvement projects.

    • Requirements:

  • Bachelor's/Master's/PhD in chemical/material/mechanical engineering or physics with min 2 years direct working experience in CMP or Bond Process
  • Good Understanding of the CMP or Bond Process concepts and how the hardware and process interact with each other.
  • Strong desire and creativity to explore process and control improvements.
  • Understanding of the Micron world-wide team structure, standards, and processes
  • Knowledge of Micron's CMP Process control methods and direct experience with general line sustaining within the area
  • The ability to train on process lessons learned, defect issues and BKM's within CMP Process
  • Strong team player with the ability to clearly communicate with content experts – written and oral (via conference calls)
  • Working knowledge of data analysis systems and SWR systems
  • Proven ability to set, measure and achieve short and long - term goals.
  • Demonstrated success in leading cross functional (RnD,Mfg) teams (preferably WW) in defining and solving process problems
  • An overall understanding of typical step sequences in a memory manufacturing traveler
  • Strong proficiency in Bond related knowledge such as Grinding, Trimming and Bonding is highly advantageous.

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