Tokyo ルネサスエレクトロニクス(株)

【仕事内容】

半導体パッケージの設計、技術開発業務

・IATF16949対応業務

・デザインレビュー、QCD対応業務

・工場への量産展開、部材メーカー、OSATとの技術協議、折衝業務

・設計ツールを用いたパッケージ構造設計、図面作成

・シミュレーションツールを用いた熱設計、応力設計

・次世代製品向け、パッケージ技術開発

※就業場所の変更の範囲、従事すべき業務の変更の範囲については、選考時に詳細をお伝えいたします。

【募集背景】

自動車、産業、インフラ、IoT分野の半導体製品およびソリューションを提供するグローバル企業で、今後も継続的成長の見込めるこれらの分野で、各商品に対応したパッケージ開発をする能力と経験を有し、将来的にチームのキーパーソンとして、次世代を担って頂けるエンジニアを募集します。

※リモートワークの頻度:週2日出社(来年以降週3日出社)

【求める人材】

・半導体パッケージ設計/開発業務経験

・半導体パッケージ OSATとの業務経験

・ビジネスレベルの日本語

・ビジネスレベルの英語

<歓迎スキル>

・FMEA、FTA、DRBFM、コアツールを用いた業務経験

・半導体パッケージ設計の業務経験

  • AutoCADなどによる図面作成、構造設計の業務経験
  • APDによる基板設計の業務経験
  • ANSYS、FloTHERMなどによる、電気、熱、応力シミュレーションの業務経験

【給与】

800万円~950万円

前職でのご経験、能力を考慮の上、同社規定により優遇いたします。

【勤務地】

東京都

【勤務時間】

09:00~17:30

【雇用・契約形態】

【待遇・福利厚生】

健康保険 厚生年金 雇用保険 労災保険通勤手当 住宅手当 残業手当 財形貯蓄制度 持株会制度 企業年金制度 など

【休日・休暇】

完全週休2日制 慶弔休暇 年末年始 夏期休暇 有給休暇 出産予定・育児休職



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    国分寺のグローバル企業が半導体パッケージの設計、技術開発業務を行うエンジニアを募集しています。自動車、産業、インフラ、IoT分野の半導体製品およびソリューションを提供する企業です。半導体パッケージ設計/開発業務経験とOSATとの業務経験が必要です。給与は¥800,000,000~¥950,000,000です。リモートワークの頻度は週2日です。 ...


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