Hiroshima Micron Technology Full time
1. Collaborate with Technology Development (TD), suppliers, and global facilities/layout teams to optimize tool‑install sequencing, qualification, ramp models, and readiness. Provide technical leadership during first‑of‑kind workstation introductions, ensuring manufacturing availability and utilization meet targets. Work with PEE teams, Quality Engineering, Central Planning, Procurement, and external suppliers to resolve issues and drive engineering improvements. Evaluate technical and operational solutions to reduce downtime, technician labor demand, and material/scrap cost. Provide expert guidance on TOR, BKM governance, process windows, and technical decision frameworks. Ensure standardization of troubleshooting flows, tool health metrics, and scanner capability indices across sites. Benchmark site performance and establish best‑known‑methods (BKMs) to reduce variability and elevate network standards. Lead assessments and recovery actions for recurring issues, chronic network bottlenecks, and tool performance gaps. Bachelor's or Master's degree in Engineering (Electrical, Mechanical, Physics, Materials, or related field). 6+ years of relevant semiconductor photo processing or scanner engineering experience. Excellent communication and collaboration skills, including supplier engagement. Strong expertise with scanner hardware, applications, diagnostics, and process‑equipment interaction. Proven ability to lead cross‑functional and cross‑site engineering initiatives. Experience with ASML scanners and advanced technology node ramps. Demonstrated success in driving large‑scale manufacturing or equipment performance programs.

Technical leadership in Photo technical engineering functions with excellent project management knowledge Experience with structured problem solving (8D, DOE, SPC).



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