Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

As a Central Product Integration Engineer at Micron Technology, you will provide technical leadership across the global Micron network to drive yield, product quality, and New Product Introduction (NPI) through deep technical expertise, business process development, and project execution.
This role operates at the intersection of Test, Product, Yield, Front‑End Manufacturing, and Packaging / BEOL integration, requiring strong across function collaboration and the ability to translate complex technical challenges into scalable solutions. You will work closely with teams across Japan, Taiwan, Singapore, and the United States to ensure products meet performance, quality, and reliability requirements within aggressive schedules. Key Responsibilities

• Lead and drive global Product Integration initiatives to improve yield, quality, and benchmark performance across technology nodes and products.
• Centralize and synthesize project information (design requirements, test challenges, yield learning) from multiple global teams and drive execution to closure.
• Drive yield breakthroughs by understanding the end‑to‑end test flow, product design and operation, packaging interactions, and manufacturing processes while balancing yield vs. reliability requirements.
• Foster technical innovation by characterizing device failure modes using deep knowledge of device architecture, physics, packaging interaction, and available test/process knobs.
• Define and drive strategies to ensure Packaging Technology and Chip‑Package Interaction are developed and qualified ahead of product qualification.
• Lead across functions and cross‑site taskforces (Product, Test, Yield, Design, Fab, Packaging, Quality, TD) to resolve yield and quality challenges in a timely manner.
• Promote network Best‑Known‑Method (BKM) development, standardization, and business process creation or re‑engineering to improve productivity and efficiency.
• Maintain strong working relationships with partners in Fab, Technology Development, Product Engineering, Test Engineering, Quality, and Packaging teams.
• Communicate project status, risks, and proposals effectively through clear written reports and technical presentations.
• Proactively identify obstacles, escalate when needed, and partner with management to drive successful outcomes.
• Travel to Micron fab and development sites as needed to support project execution and alignment.

Minimum Qualifications

• Bachelor's, Master's, or PhD degree in Electrical Engineering, Microelectronics, Physics, Chemistry, Materials Science Engineering, or a related field.
• 2+ years of experience in one or more of the following:
  • Product Integration
  • Test Engineering
  • Yield Engineering
  • Design Engineering
  • BEOL semiconductor processing or process integration
• Strong knowledge of Semiconductor Device Physics and DRAM product operations.
• Understanding of wafer fabrication process flows, parametric/electrical testing, and probe yield.
• Strong data analysis, debugging, troubleshooting, and problem‑solving skills with attention to detail.
• Effective verbal and written communication skills with the ability to present to both small and large technical audiences.
• Demonstrated ability to collaborate across functions and cultures, building strong customer and co‑worker relationships.
• Ability to work independently with minimal supervision, manage multiple priorities, and stay organized.
• Intermediate to advanced PC skills, including Microsoft Office.
• Willingness to travel approximately 20–50% to support global project needs.
• Flexibility to adapt to changing priorities and take on additional responsibilities as needed.

Preferred Qualifications

• Experience in DRAM High Bandwidth Memory (HBM) products.
• Exposure to DRAM HPM, advanced packaging, chip‑package interaction, BEOL integration, or layout‑related topics.
• Experience working across Test, Product, Yield, Design, Packaging, and Manufacturing organizations.
• Proven ability to drive alignment and execution in central or network‑level roles.
• Strong curiosity about innovation, continuous improvement, and scalable solution development.

About Micron Technology, Inc.

We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all. With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron and Crucial brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities — from the data center to the intelligent edge and across the client and mobile user experience.

To learn more, please visit

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.

To request assistance with the application process and/or for reasonable accommodations, please contact

Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.

Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.

AI alert: Candidates are encouraged to use AI tools to enhance their resume and/or application materials. However, all information provided must be accurate and reflect the candidate's true skills and experiences. Misuse of AI to fabricate or misrepresent qualifications will result in immediate disqualification.   

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