TE Connectivity's R&D/Product Development Engineering Teams conceive original ideas for new products, introduce them into practice.
They are responsible for product development, and qualification from market definition through production and release; assist in the qualification of suppliers for new products to ensure suppliers deliver quality parts, materials, and services for new or improved manufacturing processes; conduct feasibility studies, testing on new and modified designs; direct and support detailed design, testing, prototype fabrication and manufacturing ramp.
The R&D/Product Development Engineering Teams provide all required product documentation including, but not limited to, Solid Model, 2D/3D production drawings, product specifications, and testing requirements.
They create and modify detailed drawings and drafting or conceptual models from layouts, rough sketches or notes and contribute to design modifications to facilitate manufacturing operation or quality of product.
Typical fields of expertise include:
materials, mechanics and systems, electrical, optics, chemistry, software, automation systems, packaging, testing and measurement, and manufacturing of electrical, mechanical and electronic components, products, and their integration into systems
BU / FUNCTION DESCRIPTION (データ センターと人工知能向けのコネクティビティ ソリューション | TE Connectivity )
Our purpose in Data and Devices is to create a safer, sustainable, productive and connected future across our key markets:
Artificial Intelligence (AI)
Cloud
Enterprise/Telecommunications
Tier 3/Business Retail Equipment (BRE)
Internet of Things (IoT)
In these markets, we are driving growth and innovation with an industry-leading product portfolio, global manufacturing capabilities and the expertise and dedication of each of our employees across all functions.
AI Is An Emerging Trend Of a Global Industry And AI Chip Volume Is Growing. The Purpose Of D&D Socket Team Is To Create a Socket Platform ForLarge size and high speed signaling (224G/448Gbps) for AI GPU, x89 CPU and Switch NPU
S mall pitch, High density and high speed signaling (224G/448Gbps) for CPO, CPC and Near Chip
And to provide timely, technically differentiated, muti-gen solution through co-architect with our customers
ROLE OBJECTIVE
As a Signal Integrity Engineer in D&D Socket team, you will focus on the electrical design, simulation, and verification-validation testing of the CPU socket and internal connector products - targeting high speed communications and connectivity in datacenters and wireless infrastructure.
You will be expected to independently work on projects in the areas of signal integrity for socket product and system design including modeling, simulation, testing and printed circuit board layout.
You will work collaboratively within a broader cross functional team of mechanical, manufacturing and operations to execute leading edge products designs.
You will manage technical elements for the signal integrity performance of a product/platform beginning with the initial analysis through prototype fabrication, evaluation and production verification testing.
Job Requirements
As a Principal Signal Integrity Engineer of DDN socket team, you will focus on creating relationships with customer innovators and influencers, defining and driving technical activities, coordinating and facilitating technical engineering related communications for internal/external customers, creating the product standard for a key technology, and contributing to technical roadmap of the socket products.
Contribute to high-speed technology (224/448G) and product development decisions
Drives innovation and execution to increase competitiveness of socket interface products
Organize and lead conference workshop for new product development
Conduct continuous learning program and SI training to peers and cross-function teams
Act as leader of global socket SI group, mentors and coaches team's engineers.
What Your Background Should Look Like
EDUCATION/KNOWLEDGE
Bachelor's degree on Electrical Engineering/Electromagnetic Wave Engineering, Master's degree preferred.
Minimum of 5 years of work experience in a signal integrity engineering role.
Expert level knowledge of interconnect design or experience with connector.
High level of competency in Signal integrity analysis tools (Ansys HFSS, Keysight ADS).
High level of competency in Test instruments (Vector Network Analyzer, TDR)
A solid understanding of electromagnetic theory and electrical circuit behavior.
Strong analytical capabilities to interpret simulation and lab data to identify issues and provide solutions to fix identified problem. Six-Sigma methodologies or other strong data analytics background is a PLUS.
Familiarity with printed circuit board design, fabrication and assembly. Proficient in Altium Designer is a PLUS.
Cording skill of Python, C++, Visual Basic, and/or Matlab
Ability to view and edit simple 3D models using Creo/Solidworks
Excellent verbal and written communication skills.
Ability to work in a global environment, fluent in English (verbal/written), able to collaborate with individuals across geographies.
Individual must be highly motivated, a quick learner, and able to work independently
Nice To Have Skills/Experience
Printed circuit board design, fabrication and assembly (Altium, AutoCAD).
Communication systems (artificial intelligence, high-speed servers, switches, routers, storage).
Direct customer design and support experience.
Application and test knowledge of high-speed devices and equalization techniques is a plus.
Design experience with high-speed servers, switches, routers, and storage is a plus.
Competencies
SET :
Strategy, Execution, Talent (for managers)
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