電気・電子>研究・開発

メーカー>電気・電子 会員属性などに応じ、当該求人をビズリーチ上で閲覧された際に内容が異なる場合があります 仕事内容 Responsibility: 1. Packaging design for high power semiconductor laser devices. 2. Development and optimization of high thermal conductivity bonding process. 3. Design and simulation of beam shaping system for high-power semiconductor lasers and the optical coupling. 4. Test and verification of components performance and reliability.

Job Requirements: 1. Bachelor's degree and above. 2. Deep understanding of GaAs-based and GaN-based semiconductor lasers and related packaging process. 3. Familiar with solders, substrates, packaging materials, optical coupling, aging test, and fluorescent materials/components for high-power lasers. With industry-related experience is preferred. 4. Be proficient in using simulation software for optical design and simulation, stress simulation, and thermal simulation. 産休・育休取得実績あり 年間休日120日以上 女性管理職実績あり 自社サービス・製品あり 従業員数1000人以上 シェアトップクラス 外資系企業 社内公用語が英語

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