いすゞ自動車では現在、臨時のトラック製造の期間従業員(期間工)を募集しております。業務内容は鋳造→鍛造→機械加工→プレス→溶接→塗装→成形→組立のような工程で自動車を組み立てます。 · ...

未経験でも安心して始められます。家電付き個室寮が無料なので、遠方からの応募も大歓迎です。 · 正社員登用制度あり（登用実績あり） · 帰任旅費 · 通勤交通費 · 社会保険完備 · 社員食堂あり · 診療所あり作業服貸与 · シャワールームあり（栃木工場） · ...

This is an exciting position overseeing environmental, safety, and health operations for Japan's cutting-edge semiconductor back-end equipment and materials. You will collaborate with headquarters and ESH managers worldwide to build global partnerships. · Formulation of ESH manag ...

Lead the design of cutting-edge technology and collaborate with diverse teams to optimize product reliability and efficiency. This is an excellent opportunity to contribute to innovation. · Manage packaging materials design rules for internal/external(customer) design guidance. · ...

By collaborating with diverse stakeholders and engaging in the development of cutting-edge substrate prototypes, you help shape the future of new technologies. You will manage project quality and timelines, finding fulfillment in leading technological advancements. · Manage inter ...

Being able to shape your ideas while engaging with the most advanced technologies is a key attraction. Experience at a global leading company offers a significant career leap, providing an opportunity to pursue innovation and experience personal growth in a dynamic environment. · ...

This role offers a prime opportunity to lead innovation in next-generation substrate technology and collaborate with suppliers to solve technical challenges. · Manage advanced substrate technology development and pathfinding activities · Define key technology building blocks to e ...

TSMC Japan 3DIC Research and Development Center is a subsidiary of Taiwan Semiconductor Manufacturing Company Limited, located in Tsukuba, Ibaraki Prefecture. The center is engaged in research and development of next-generation 3D integration technology and advanced packaging tec ...

TSMC Japan 3DIC Research and Development Center is a subsidiary of Taiwan Semiconductor Manufacturing Company Limited, located in Tsukuba, Japan. The center is responsible for developing next-generation 3D IC technology and advanced packaging technology in collaboration with Japa ...

Develop new materials using advanced technology and achieve innovative cooling solutions through global collaboration. · Collaborate with Japanese materials manufacturers to develop new TIM materials with extremely low thermal resistance. · Utilize thermal resistance measurement ...